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| AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator 1.0 General Description Data Sheet The AMIS-40615 is a full-featured local interconnect network (LIN) transceiver designed to interface between a LIN protocol controller and the physical bus. The transceiver is implemented in AMI Semiconductor's SmartPower, high-voltage, mixed-signal 0.35m CMOS technology enabling both high-voltage analog circuitry and digital functionality to co-exist on the same chip. The AMIS-40615 LIN device is a member of AMI Semiconductor's in-vehicle networking (IVN) transceiver family and integrates a LIN v2.0 physical transceiver and a 3.3V voltage regulator. It is designed to work in harsh automotive environments and is certified to the TS16949 qualification flow. The LIN bus is designed to communicate low rate data from control devices such as door locks, mirrors, car seats, and sunroofs at the lowest possible cost. The bus is designed to eliminate as much wiring as possible and is implemented using a single wire in each node. 2.0 Key Features 2.1 LIN-Bus Transceiver * * * * * LIN compliant to specification revision 2.0 (backwards compatible to version 1.3) and J2602 SmartPower, high-voltage, mixed-signal 0.35m CMOS technology Bus voltage 45V Transmission rate up to 20kBaud SOIC 14 Green package 2.2 Protection * * * * * Thermal shutdown Indefinite short-circuit protection on pins LIN and WAKE towards supply and ground Load dump protection (45V) Bus pins protected against transients in an automotive environment ESD protection level for LIN, INH, WAKE, and Vbb up to 8kV 2.3 EMI Compatibility * Integrated slope control 2.4 Voltage Regulator * * * * Output voltage 3.3V / ~50mA Wake-up input Enable inputs for stand-by and sleep mode INH output for auxiliary purposes (switching of an external pull-up or resistive divider towards battery, control of an external voltage regulator etc.) 2.5 Modes * * * * Normal mode: LIN communication with either low (up to 10kBaud) or normal slope Sleep mode: VCC is switched "off" and no communication on LIN bus Stand-by mode: VCC is switched "on" but there is no communication on LIN bus Wake-up bringing the component from sleep mode into standby mode is possible either by LIN command or digital input signal on WAKE pin. Wake-up from LIN bus can also be detected and flagged when the chip is already in standby mode. AMI Semiconductor - March 2007, M-20544-001 1 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator 3.0 Ordering Information Table 1: Ordering Information Marketing Name AMIS40615 AGA Package SOIC 150 14 GREEN (JEDEC MS-012) Data Sheet Temperature Range -40C...105C 4.0 Key Technical Characteristics Table 2: Key Technical Characteristics Symbol Parameter Vbb Nominal battery operating voltage (1) Vbb Load dump protection Ibb_SLP Supply current in sleep mode Regulated Vcc output in normal mode, Vcc load 1mA-30mA (5) Vcc_out Regulated Vcc output in normal mode, Vcc load 0mA-50mA Regulated Vcc output in standby mode, Vcc load 0mA-50mA (2) Maximum continuous Vcc output current Iout_max (2) Maximum Vcc output current, thermal shutdown can occur Operating DC voltage on WAKE pin V_wake Maximum rating voltage on WAKE pin Tj Junction thermal shutdown temperature Tamb Operating ambient temperature (3) Vesd Electrostatic discharge voltage (LIN, INH, WAKE, VBB) System HBM (4) Electrostatic discharge voltage (LIN, INH, WAKE, VBB) HBM (4) Electrostatic discharge voltage (other pins) HBM Notes: 1. 2. 3. 4. 5. The applied transients shall be in accordance with ISO 7637 part 1, test pulse 5. The device complies with functional class C; class A can be reached depending on the application and external components. Current limitation is set above 50mA but thermal shutdown can occur for currents above 30mA. Equivalent to discharging a 150pF capacitor through a 330 resistor conform to IEC Standard 1000-4-2. The specified values are a target to be verified on first prototypes. Based on the evaluation results, additional external protection components might be recommended to reach the specified system ESD levels Equivalent to discharging a 100pF capacitor through a 1.5k resistor conform to MIL STD 883 method 3015.7. Vcc voltage must be properly stabilized by external capacitors: capacitor of min. 80nF with ESR<10m in parallel with a capacitor of min. 8F, ESR<1. Min. 5 Typ. 12 3.23 3.19 3.17 30 50 0 -45 165 -40 -8 -4 -2 3.30 3.30 3.30 Max. 26 45 20 3.37 3.41 3.43 Vbb 45 195 +105 +8 +4 +2 Unit V V A V V V mA mA V V C C kV kV kV AMI Semiconductor - March 2007, M-20544-001 2 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator 5.0 Block Diagram VCC OTP_ZAP V-reg VCC Data Sheet VBB INH Osc Bandgap STB WAKE EN VBB State & Wake-up Control Thermal shutdown RxD VCC COMP Filter LIN TxD time-out Slope Control TEST VBB VCC POR AMIS-40615 PD20061213.1 GND Figure 1: Block Diagram AMI Semiconductor - March 2007, M-20544-001 3 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator 6.0 Typical Application 6.1 Application Schematic Data Sheet The EMC immunity of the master-mode device can be further enhanced by adding a capacitor between the LIN output and ground. The optimum value of this capacitor is determined by the length and capacitance of the LIN bus, the number and capacitance of slave devices, the pull-up resistance of all devices (master & slave), and the required time constant of the system, respectively. Vcc voltage must be properly stabilized by external capacitors: capacitor of min. 80nF (ESR<10m) in parallel with a capacitor of min. 8F (ESR<1). VBAT 10 uF 100nF VBB 11 1 14 Master Node 10 uF 100nF VCC 13 Slave Node VBAT 10 uF 100nF VBB 11 1 14 10 uF 100nF VCC 13 INH 1 nF 1 k VCC RxD TxD EN STB GND VCC RxD TxD EN STB GND LIN WAKE 10nF WAKE GND 5 GND 10nF 10 7 3 4 11 8 WAKE GND 220pF LIN 2 AMIS- 12 40615 9 Micro controller LIN LIN 2 AMIS- 12 40615 9 10 7 3 4 11 8 Micro controller WAKE 5 GND KL30 LIN-BUS KL31 Figure 2: Typical Application Diagram 6.2 Pin Description 6.2.1. Pin Out (top view) VBB LIN GND GND WAKE INH OTP_ZAP 1 2 3 4 5 6 7 14 13 12 11 10 9 8 PC20060426.1 VCC RxD TxD GND STB EN TEST Figure 3: Pin Configuration AMIS40615 AMI Semiconductor - March 2007, M-20544-001 4 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator 6.2.2. Pin Description Table 3: Pin Description Pin Name 1 VBB 2 LIN 3 GND 4 GND 5 WAKE 6 INH 7 OTP_ZAP 8 TEST 9 EN 10 STB 11 GND 12 TxD 13 RxD 14 Vcc Description Battery supply input LIN bus output/input Ground Ground High voltage digital input pin to switch the part from sleep- to stand-by-mode Inhibit output Supply for programming of trimming bits at factory testing, should be grounded in the application Digital input for factory testing, should be grounded in the application Enable input, transceiver in normal operation mode when high Standby mode control input Ground Transmit data input, low in dominant state Receive data output; low in dominant state; push-pull output Supply voltage (output) Data Sheet AMI Semiconductor - March 2007, M-20544-001 5 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Data Sheet 7.0 Functional Description 7.1 Overall Functional Description LIN is a serial communication protocol that efficiently supports the control of mechatronic nodes in distributed automotive applications. The domain is class-A multiplex buses with a single master node and a set of slave nodes. AMIS-40615 is designed as a master or slave node for the LIN communication interface with integrated 3.3V voltage regulator having a current capability up to 50mA for supplying any external components (microcontroller). AMIS-40615 contains the LIN transmitter, LIN receiver, voltage regulator, power-on-reset (POR) circuits, and thermal shutdown (TSD). The LIN transmitter is optimized for the maximum specified transmission speed of 20kBaud with EMC performance due to reduced slew rate of the LIN output. The junction temperature is monitored via a thermal shutdown circuit that switches the LIN transmitter and voltage regulator off when temperature exceeds the TSD trigger level. AMIS-40615 has four operating states (normal mode, low slope mode, stand-by mode, and sleep mode) that are determined by the input signals EN, WAKE, STB, and TxD. 7.2 Operating States AMIS-40615 provides four operating states, two modes for normal operation with communication, one stand-by without communication and one low power mode with very low current consumption. See Figure 4. Power up Vbb - Stand-by mode Vcc: "on" LIN TX: "off" INH: "floating" Term: "current source" " RxD: high/low EN goes from 0 to 1 while TxD = 1 - Normal mode (normal slope) Vcc: "on" LIN TX: "on" INH: "high"/"floating" Term: 30k RxD: LIN data EN goes from 1 to 0 while STB = 1 EN goes from 0 to 1 while TxD = 0 EN goes from 1 to 0 while STB = 1 Local wake-up or LIN wake-up Normal mode (low slope) Vcc: "on" LIN TX: "on" INH: "high"/"floating" Term: 30k RxD: LIN data EN goes from 1 to 0 while STB = 0 Figure 4: State Diagram AMI Semiconductor - March 2007, M-20544-001 6 www.amis.com EN goes from 1 to 0 while STB = 0 - Sleep mode Vcc: "off" LIN TX: "off" INH: "floating" Term: "current source" RxD: =VCC AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Table 4: Mode Selection Mode Vcc Normal - Slope On Normal - Low Slope Stand-by Sleep Notes: 1. 2. 3. Data Sheet On On Off RxD Low = dominant state High = recessive state Low = dominant state High = recessive state Low after LIN wakeup, high otherwise Clamped to Vcc INH High if STB = High during state transition; floating otherwise High if STB = High during state transition; floating otherwise Floating Floating LIN Normal slope Low slope Off Off 30k on LIN On On Off Off Note (1) (2) (3) The normal slope mode is entered when pin EN goes high while TxD is in high state during EN transition. The low slope mode is entered when pin EN goes high while TxD is in low state during EN transition. LIN transmitter gets on only after TxD returns to high after the state transition. The stand-by mode is entered automatically after power-up. 7.2.1. Normal Slope Mode In normal slope mode the transceiver can transmit and receive data via LIN bus with speed up to 20kBaud. The transmit data stream of the LIN protocol is present on the TxD pin and converted by the transmitter into a LIN bus signal with controlled slew rate to minimize EMC emission. The receiver consists of the comparator that has a threshold with hysteresis in respect to the supply voltage and an input filter to remove bus noise. The LIN output is pulled high via an internal 30k pull-up resistor. For master applications it is needed to put an external 1k resistor with a serial diode between LIN and Vbb (or INH). See Figure 2. The mode selection is done by EN=HIGH when TxD pin is high. If STB pin is high during the stand-by-to-normal slope mode transition, INH pin is pulled high. Otherwise, it stays floating. 7.2.2. Low Slope Mode In low slope mode the slew rate of the signal on the LIN bus is reduced (rising and falling edges of the LIN bus signal are longer). This further reduces the EMC emission. As a consequence the maximum speed on the LIN bus is reduced up to 10kBaud. This mode is suited for applications where the communication speed is not critical. The mode selection is done by EN=HIGH when TxD pin is low. In order not to transmit immediately a dominant state on the bus (because TxD=LOW), the LIN transmitter is enabled only after TxD returns to high. If STB pin is high during the standby-to-low slope mode transition, INH pin is pulled high. Otherwise, it stays floating. 7.2.3. Stand-by Mode The stand-by mode is always entered after power-up of the AMIS-40615. It can also be entered from normal mode when the EN pin is low and the stand-by pin is high. From sleep mode it can be entered after a local wake-up or LIN wakeup. In stand-by mode the Vcc voltage regulator for supplying external components (e.g. a microcontroller) stays active. Also the LIN receiver stays active to be able to detect a remote wake-up via bus. The LIN transmitter is disabled and the slave internal termination resistor of 30k between LIN and Vbb is disconnected in order to minimize current consumption. Only a pull-up current source between Vbb and LIN is active. 7.2.4. Sleep Mode The sleep mode provides extreme low current consumption. This mode is entered when both EN and STB pins are low coming from normal mode. The internal termination resistor of 30k between LIN and Vbb is disconnected and also the Vcc regulator is switched off to minimize current consumption. 7.2.5. Wake-up AMIS-40615 has two possibilities to wake-up from sleep or stand-by mode (see Figure 4): * Local wake-up: enables the transition from sleep mode to stand-by mode. * Remote wake-up via LIN: enables the transition from sleep- to stand-by mode and can be also detected when already in standby mode. A local wake-up is only detected in sleep mode if a transition from low to high or from high to low is seen on the wake pin. AMI Semiconductor - March 2007, M-20544-001 7 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Data Sheet Wake VBB Detection of Local Wake-Up Wake VBB 50% VBB typ. Detection of Local Wake-Up 50% VBB typ. Sleep Mode Stand-by Mode t Sleep Mode Stand-by Mode PC20060427.3 t Figure 5: Local Wake-up Signal A remote wake-up is only detected if a combination of (1) a falling edge at the LIN pin (transition from recessive to dominant) is followed by (2) a dominant level maintained for a time period > tWAKE and (3) again a rising edge at pin LIN (transition from dominant to recessive) happens. LIN Detection of Remote Wake-Up VBB tWAKE 40% Vbb LIN dominant level Sleep Mode Stand-by Mode 60% Vbb LIN recessive level t PC20060427.2 Figure 6: Remote Wake-up Behavior The wake-up source is distinguished by pin RxD in the stand-by mode: * RxD remains high after power-up or local wake-up. * RxD is kept low until normal mode is entered after a remote wake-up (LIN). AMI Semiconductor - March 2007, M-20544-001 8 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Data Sheet 8.0 Electrical Characteristics 8.1 Definitions All voltages are referenced to GND (Pin 13). Positive currents flow into the IC. 8.2 Absolute Maximum Ratings Stresses above those listed in this clause may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability. Table 5: Absolute Maximum Ratings Symbol Parameter (1) Vbb Battery voltage on pin Vbb Vcc DC voltage on pin Vcc I_Vcc Current delivered by the Vcc regulator (2) V_LIN LIN bus voltage V_INH DC voltage on inhibit pin V_WAKE DC voltage on WAKE pin V_Dig_in DC input voltage on pins TxD, RxD, EN, STB Tjunc Maximum junction temperature (3) Vesd Electrostatic discharge voltage (pins LIN, INH, WAKE, and Vbb) system HBM (4) Electrostatic discharge voltage (pins LIN, INH, WAKE, and Vbb) HBM (4) Electrostatic discharge voltage (other pins) HBM (5) Electrostatic discharge voltage; charge device model Notes: 1. 2. 3. 4. 5. Min. -0.3 0 50 -45 -0.3 -45 -0.3 -40 -8 -4 -2.0 -250 Max. +45 +7 +45 Vbb + 0.3 45 Vcc + 0.3 +165 +8 +4 +2.0 +250 Unit V V mA V V V V C kV kV kV V The applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, and 5. The device complies with functional class C; class A can be reached depending on the application and external components. The applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, and 3b. The device complies with functional class C; class A can be reached depending on the application and external components. Equivalent to discharging a 150pF capacitor through a 330 resistor conform to IEC Standard 1000-4-2. The specified values are a target to be verified on first prototypes. Based on the evaluation results, additional external protection components might be recommended to reach the specified system ESD levels. Equivalent to discharging a 100pF capacitor through a 1.5k resistor conform to MIL STD 883 method 3015.7. Conform to EOS/ESD-DS5.3 (socket mode). 8.3 DC Characteristics VBB = 5V to 26V; Tjunc = -40C to +150C; unless otherwise specified. Table 6: DC Characteristics Supply Symbol Parameter Pins VBB and VCC Ibb_ON Supply current Ibb_STB Supply current Ibb_SLP Supply current Regulator output voltage Vcc_out Regulator output voltage Regulator output voltage Iout_max_cont Maximum output current Iout_max_conta Maximum output current Iout_max_abs Absolute maximum output current Iout_lim Over-current limitation Conditions Normal mode; LIN recessive Stand-by mode, Vbb = 5 - 18V Sleep mode, Vbb = 5 - 18V Normal mode, Vcc load 1mA-30mA Normal mode, Vcc load 0mA-50mA Stand-by mode, Vcc load 0mA-50mA Vbb = 16V; Tamb = 105C Vbb = 26V; limited lifetime Thermal shutdown can occur Min. Typ. Max. 1 60 20 3.37 3.41 3.43 30 30 50 150 Unit mA A A V V V mA mA mA mA 3.23 3.19 3.17 3.30 3.30 3.30 50 AMI Semiconductor - March 2007, M-20544-001 9 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Table 7: DC Characteristics LIN Transmitter Symbol Parameter Pin LIN VLin_dom_LoSup LIN dominant output voltage VLin_dom_HiSup LIN dominant output voltage VLin_rec LIN recessive output voltage ILIN_lim Short circuit current limitation Rslave Internal pull-up resistance ILIN_off_dom LIN output current bus in dominant state ILIN_off_rec LIN output current bus in recessive state ILIN_no_GND Communication not affected ILIN_no_Vbb LIN bus remains operational Note: 1. V is the forward diode voltage. Typically (over the complete temperature) V = 1V. Data Sheet Conditions TXD = low; Vbb = 7.3V TXD = low; Vbb = 18V TXD = high; Ilin = 0mA VLin = Vbb_max Driver off; Vbb = 12V Driver off; Vbb = 12V Vbb = GND = 12V; 0 < VLin < 18V Vbb = GND = 0V; 0 < VLin < 18V Min. Typ. Max. 1.2 2.0 Unit V V V mA k mA A mA A Vbb - V (1) 40 20 -1 -1 33 130 47 20 1 100 Table 8: DC Characteristics LIN Receiver Symbol Parameter Pin LIN Vrec_dom Receiver threshold Vrec_rec Receiver threshold Vrec_cnt Receiver center voltage Vrec_hys Receiver hysteresis Conditions LIN bus recessive dominant LIN bus dominant recessive (Vbus_dom + Vbus_rec) / 2 Min. 0.4 0.4 0.475 0.05 Typ. Max. 0.6 0.6 0.525 0.175 Unit Vbb Vbb Vbb Vbb Table 9: DC Characteristics I/Os Symbol Parameter Pin WAKE V_wake_th Threshold voltage (1) I_leak Input leakage current T_wake_min Debounce time Pins TxD and STB Vil Low level input voltage Vih High level input voltage (1) Rpu Pull-up resistance to Vcc Pin INH Delta_VH High level voltage drop I_leak Leakage current Pin EN Vil Low level input voltage Vih High level input voltage (1) Rpd Pull-down resistance to ground Pin RxD Vol Low level output voltage Voh High level output voltage Note: 1. Conditions Vwake = 0V; Vbb = 18V Sleep mode; rising and falling edge Min. 0.35 -1 8 Typ. Max. 0.65 1 54 0.8 Unit Vbb A s V V k V A V V k V V -0.5 2.0 50 IINH = 15mA Sleep mode; VINH = 0V 0.35 -1 200 0.75 1 0.8 2.0 50 Isink = 2mA Isource = -2mA 200 0.65 Vcc - 0.65V By one of the trimming bits, following reconfiguration can be done during chip-level testing in order to fit the AMIS-40615 into different interface: pins TxD and EN will have typ. 10k pull-down resistor to ground and pin WAKE will have typ. 10A pull-up current source. Table 10: DC Characteristics Symbol Parameter POR PORH_Vbb POR high level Vbb comparator PORL_Vbb POR low level Vbb comparator POR_Vbb_hyst Hysteresis of POR level Vbb comparator POR_Vbb_sl Maximum slope on Vbb to guarantee POR PORH_Vcc POR high level Vcc comparator PORL_Vcc POR low level Vcc comparator POR_Vcc_hyst Hysteresis of POR level Vcc comparator TSD Tj Junction temperature Tj_hyst Thermal shutdown hysteresis Conditions Min. 3 100 Typ. Max. 4.5 Unit V V mV V/ms V V mV C C 50 3 2 100 For shutdown 165 9 195 18 AMI Semiconductor - March 2007, M-20544-001 10 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Data Sheet 8.4 AC Characteristics VBB = 7V to 18V; Tjunc = -40C to +150C; unless otherwise specified. Table 11: AC Characteristics LIN Transmitter Symbol Parameter Pin LIN D1 D2 T_fall_norm T_rise_norm T_sym_norm T_fall_norm T_rise_norm T_sym_norm T_fall_low T_rise_low T_wake T_dom Notes: 1. 2. Conditions THREC(min) = 0.284 x Vbb THDOM(min) = 0.422 x Vbb TBIT = 50s THREC(max) = 0.744 x Vbb THDOM(max) = 0.581 x Vbb TBIT = 50s (1) Normal slope mode; Vbb = 12V; L1, L2 (1) Normal slope mode; Vbb = 12V; L1, L2 (1) Normal slope mode; Vbb = 12V; L1, L2 (1) Normal slope mode; Vbb = 12V; L3 (1) Normal slope mode; Vbb = 12V; L3 (1) Normal slope mode; Vbb = 12V; L3 (2) (1) Low slope mode ; Vbb = 12V; L3 (2) (1) Low slope mode ; Vbb = 12V; L3 TxD = low Min. 0.396 Typ. Max. Unit Duty cycle 1 = tBUS_REC(min) / (2 x TBit) Duty cycle 2 = tBUS_REC(max) / (2 x TBit) LIN falling edge LIN rising edge LIN slope symmetry LIN falling edge LIN rising edge LIN slope symmetry LIN falling edge LIN rising edge Dominant time-out for wake-up via LIN bus TxD dominant time-out 0.581 22.5 22.5 4 27 27 5 62 62 150 20 s s s s s s s s s ms -4 -5 30 6 The AC parameters are specified for following RC loads on the LIN bus: L1 = 1k / 1nF; L2 = 660 / 6.8nF; L3 = 500 / 10nF. Low slope mode is not compliant to the LIN 1.3 or LIN 2.0 standard. AMI Semiconductor - March 2007, M-20544-001 11 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Data Sheet TxD tBIT 50% tBIT t LIN THRec(max) THDom(max) THRec(min) THDom(min) tBUS_dom(max) tBUS_rec(min) Thresholds of receiving node 1 Thresholds of receiving node 2 t tBUS_dom(min) tBUS_rec(max) PC20060428.2 Figure 7: LIN Transmitter Duty Cycle LIN 100% 60% 40% 60% 40% 0% t T_fall T_rise PC20060428.1 Figure 8: LIN Transmitter Rising and Falling Times AMI Semiconductor - March 2007, M-20544-001 12 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Table 12: AC Characteristics LIN Receiver Symbol Parameter Pin LIN Trec_prop_down Propagation delay of receiver falling edge Trec_prop_up Propagation delay of receiver rising edge Trec_sym Propagation delay symmetry Conditions Min. 0.1 0.1 -2 Typ. Data Sheet Max. 6 6 2 Unit s s s Trec_prop_down - Trec_prop_up LIN Vbb 60% Vbb 40% Vbb t RxD trec_prop_down trec_prop_up 50% t Figure 9: LIN Receiver Timing PC20060428.3 AMI Semiconductor - March 2007, M-20544-001 13 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Data Sheet 9.0 Package Outline SOIC-14: Plastic small outline; 14 leads; body width 150mil; JEDEC: MS-012 AMIS reference: SOIC150 14 150 G AMI Semiconductor - March 2007, M-20544-001 14 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Data Sheet 10.0 Soldering 10.1 Introduction to Soldering Surface Mount Packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCBs) with high population densities. In these situations re-flow soldering is often used. 10.2 Re-flow Soldering Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by screen printing, stenciling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 260C. 10.3 Wave Soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the PCB; o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the PCB. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 10.4 Manual Soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320C. AMI Semiconductor - March 2007, M-20544-001 15 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Table 13: Soldering Process Package Wave BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS (3) PLCC , SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes: 1. 2. 3. 4. 5. Data Sheet Soldering Method Re-flow Suitable Suitable Suitable Suitable Suitable Not suitable (2) Not suitable Suitable (3)(4) Not recommended (5) Not recommended (1) All SMD packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the dry pack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". These packages are not suitable for wave soldering as a solder joint between the PCB and heat sink (at bottom version) can not be achieved, and as solder may stick to the heat sink (on top version). If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal or smaller than 0.65mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. 11.0 Revision History Table 14: Revision History Revision Date 1.0 28 April 2006 1.1 9 May 2006 1.2 23 June 2006 Format Preliminary Preliminary Preliminary Description Initial document Updated absolute maximum ratings updated parameters - Vcc, WAKE, INH updated ESD and Schaffner requirements changed pinout updated description of wakeup functionality updated description of INH functionality updated soldering information according the green package requirements block diagram - serial diode added to the LIN pullup source to comply with the implementation application diagram - capacitor on WAKE placed in front of the serial resistance pin description - WAKE pin description corrected document footer: introduced revision number and date, introduced http link Vbb ranges for parameters aligned with the Key Technical Characteristics and the LIN protocol requirements - 7-18V for LIN-related parameters, 5-26V for others Vbb for standby and sleepmode consumption limited to 5V-18V Vcc accuracy specified until 50mA in two accuracy ranges voltage on pin WAKE extended to -Vbb in Table 2 and Table 5 par. 2.4: indicating 50mA current capability of Vcc I_out_max specified for 30mA and 50mA in Table 2 Tjunc in Table 5 updated to 165C Figure 4: clarified descriptions of the mode transitions to indicate edge-sensitivity on EN pin Figure 1 and Table 3: explicit picture and note about push-pull output on RxD output Figure 6: typing error correction in the figure title Delta_VH in Table 9: max limit corrected and typical value added specification of stabilization capacitors on Vcc added to Table 2 and par. 6.1. added max. threshold of thermal shutdown in Table 2 and Table 10 corrected typing errors and wording in Figure 4 changed negative maximum rating voltage on WAKE pin - see Table 2 and Table 5 maximum rating of LIN and WAKE pins adopted to 45V in Table 2 and Table 5 corrected note 1 of Table 9 (regarding trimming for another application) package drawing updated by a better readable image (no content changes) in par. 9.0 input/output levels of digital pins re-defined in terms of absolute voltage - see Table 9 clarified statement on the indefinite short-protection in par. 2.2 1.3 1.4 8 August 2006 13 December 2006 Preliminary Preliminary 1.5 1.6 1.7 14 December 2006 18 January 2007 6 March 2007 Preliminary Preliminary Preliminary AMI Semiconductor - March 2007, M-20544-001 16 www.amis.com AMIS-40615 LIN Transceiver with 3.3V Voltage Regulator Data Sheet 12.0 Company or Product Inquiries For more information about AMI Semiconductor's LIN transceivers, send an email to auto_assp@amis.com. For more information about AMI Semiconductor's products or services visit our Web site at http://www.amis.com. Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sales only. AMIS makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright(c) 2007 AMI Semiconductor, Inc. AMI Semiconductor - March 2007, M-20544-001 17 www.amis.com |
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